By shelling out for the best.
"Specification Will Encourage Lower Power Consumption for Countless Consumer Electronics, Networking and Computer Products".
24 XMP extension edit Intel Corporation officially introduced the eXtreme Memory Profile ( XMP ) Specification on March 23, 2007 to enable enthusiast performance extensions to the traditional jedec SPD specifications for DDR3 sdram.This is the key difference in the physical appearance of the two rams.15 Alternative naming: DDR3 modules are often incorrectly labeled with the prefix PC (instead of PC3 for marketing reasons, followed by the data-rate."I'M Intelligent Memory to release 16GB Unregistered DDR3 Modules".The development teams have led to the invention of a newer model of the DDR3 Ram which was the DDR4 Ram.25 Feature summary edit Components edit Introduction of asynchronous reset pin Support of system-level flight-time compensation On- dimm mirror-friendly dram pinout Introduction of CWL (CAS write titan casino cashier latency) per clock bin On-die I/O calibration engine read and write calibration Dynamic ODT (On-Die-Termination) feature allows different termination.The new series is more affordable, faster, and has a less tacky heatsink.For the video game, see.Specifically, DDR3 uses sstl_15.Archived from the original (PDF).
RAM to some extent improves the gaming performances on a computer hence, using a multi-core and high speed read and write RAM stick really helps improve the performance of the computer.
External links edit jedec standard.
The refresh algorithm of the RAMs be it DDR3 or DDR4 RAM stick, all depends on the interior temperature of the CPU and also depends on the onboard temperature of the RAM sticks.
Module density effects the overall performance of the RAM stick as the chips used in the manufacturing process tend to have higher modular density thus, housing more RAM on every chip.